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博士生丁福源的论文在NANOSCALE刊出
发布时间:2014-09-04     发布者:yz         审核者:     浏览次数:

标题:Emerging chitin and chitosan nanofibrous materials for biomedical applications作者:Ding, Fuyuan; Deng, Hongbing; Du, Yumin; Shi, Xiaowen; Wang, Qun

来源出版物:NANOSCALE 卷:6 期:16 页:9477-9493 DOI:10.1039/c4nr02814g 出版年:AUG 21 2014

摘要:Over the past several decades, we have witnessed significant progress in chitosan and chitin based nanostructured materials. The nanofibers from chitin and chitosan with appealing physical and biological features have attracted intense attention due to their excellent biological properties related to biodegradability, biocompatibitity, antibacterial activity, low immunogenicity and wound healing capacity. Various methods, such as electrospinning, self-assembly, phase separation, mechanical treatment, printing, uttrasonication and chemical treatment were employed to prepare chitin and chitosan nanofibers. These nanofibrous materials have tremendous potential to be used as drug delivery systems, tissue engineering scaffolds, wound dressing materials, antimicrobial agents, and biosensors. This review article discusses the most recent progress in the preparation and application of chitin and chitosan based nanofibrous materials in biomedical fields.

入藏号:WOS:000340217900015

文献类型:Review

语种:English

扩展关键词:TISSUE ENGINEERING SCAFFOLDS; DRUG CONTROLLED-RELEASE; WOUND-DRESSING APPLICATIONS; NAOH/UREA AQUEOUS-SOLUTION; GLYCOL BLEND FIBERS; IN-VITRO EVALUATION; QUATERNIZED CHITOSAN; COMPOSITE NANOFIBERS; POLY(VINYL ALCOHOL); ELECTROSPUN FIBERS

通讯作者地址:

电子邮件地址:shixwwhu@163.com; qunwang@iastate.edu

地址:

[Ding, Fuyuan; Deng, Hongbing; Du, Yumin; Shi, Xiaowen] Wuhan Univ, Sch Resource & Environm Sci, Wuhan 430079, Peoples R China.

[Ding, Fuyuan; Deng, Hongbing; Du, Yumin; Shi, Xiaowen] Wuhan Univ, Hubei Biomass Resource Chem & Environm Biotechnol, Wuhan 430079, Peoples R China.

[Wang, Qun] Iowa State Univ, Dept Chem & Biol Engn, Ames, IA 50011 USA.

研究方向:Chemistry; Science & Technology - Other Topics; Materials Science; Physics

ISSN:2040-3364

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